Das in der 3DGence INDUSTRY F421 und INDUSTRY F350 verwendete modulare System ist eine praktische und kostengünstige Lösung. 3DGence modularen System ist einzigartig im Segment der industriellen 3D-Drucker. Die Möglichkeit, vier verschiedene Module in einem 3D-Drucker zu verwenden, ermöglicht es Ihnen, wiederholbare Modelle aus den unterschiedlichsten Filamenten zu erstellen. Jedes Modul wird an eine bestimmte Materialgruppe angepasst, um den Druckprozess zu optimieren. Der interne Modulspeicher spart Zeit für die Kalibrierung. Alle Module sind außerdem mit zwei Hotends und einem inaktiven Düsenhubsystem ausgestattet.
Grundlegendes Druckmodul für 3DGence INDUSTRY F421 und INDUSTRY F350, mit dem die Rohstoffe gedruckt werden können. Das M280-Modul kann auch lösliche Trägerstrukturen aus ESM-10 drucken.
3DGence DOUBLE enables 3D printing from water-soluble material BVOH, which allows removing supports without problems. Thanks to this solution you don’t have to manually deal with supports printed with HIPS or other breakaway materials.
An attempt to remove the supports mechanically may cause damage to the printout. BVOH support material gives the possibility of rinsing support material from the model and leave it in a perfect form.
Is the water temperature relevant?
The best effects of dissolving support material can be achieved with warm water. However, it can not be a temperature that threatens the building material. Water heated up to approx. 50°C will help remove the supports from the printout much faster. This process can also be improved by mixing water.
Finally, ensuring optimal conditions, such as in an ultrasonic cleaner, will dissolve the BVOH filament in just a few minutes.
M360 ist ein Hochtemperatur-INDUSTRIE-F421-Modul, mit dem Benutzer die Modelle von ULTEM ™ drucken können – Hochleistungspolymer mit sehr guten mechanischen Eigenschaften und hohen Temperaturen. M360 kann auch technische Materialien wie PC drucken.
3DGence DOUBLE enables 3D printing from water-soluble material BVOH, which allows removing supports without problems. Thanks to this solution you don’t have to manually deal with supports printed with HIPS or other breakaway materials.
An attempt to remove the supports mechanically may cause damage to the printout. BVOH support material gives the possibility of rinsing support material from the model and leave it in a perfect form.
Is the water temperature relevant?
The best effects of dissolving support material can be achieved with warm water. However, it can not be a temperature that threatens the building material. Water heated up to approx. 50°C will help remove the supports from the printout much faster. This process can also be improved by mixing water.
Finally, ensuring optimal conditions, such as in an ultrasonic cleaner, will dissolve the BVOH filament in just a few minutes.
M500 ist eines der austauschbaren Module die eine Extrusionstemperatur von bis zu 500 °C erreichen können. Diese hohe Temperatur in Kombination mit der beheizten Kammer des Druckers ermöglicht das Drucken von Hochleistungspolymeren wie PEEK oder PEKK auf INDUSTRY F421. Das M500-Modul kann PEEK und PEKK auf dem löslichen ESM-10-Träger drucken.
3DGence DOUBLE enables 3D printing from water-soluble material BVOH, which allows removing supports without problems. Thanks to this solution you don’t have to manually deal with supports printed with HIPS or other breakaway materials.
An attempt to remove the supports mechanically may cause damage to the printout. BVOH support material gives the possibility of rinsing support material from the model and leave it in a perfect form.
Is the water temperature relevant?
The best effects of dissolving support material can be achieved with warm water. However, it can not be a temperature that threatens the building material. Water heated up to approx. 50°C will help remove the supports from the printout much faster. This process can also be improved by mixing water.
Finally, ensuring optimal conditions, such as in an ultrasonic cleaner, will dissolve the BVOH filament in just a few minutes.
Bis zu 280°C
Bis zu 360°C
Bis zu 500°C
0,5 / 0,5 mm
0,4 / 0,4 mm
0,4 / 0,4 mm
ABS, ASA, PLA, PA6
PC
ULTEM (nur für INDUSTRY F421)
PEEK
ULTEM (nur für INDUSTRY F421)
HIPS (Loslösung)
ESM-10 (Löslich)
ESM-10 (Löslich)
ESM-10 (Löslich)
| Print Temperature | 340 – 500°C |
|---|---|
| Nozzle Diameter | 0,4 / 0,4 mm |
| Model Materials | PEEK, PEKK |
| Support Materials | Dedicated breakaway ESM-10 (soluble) |
| Print Temperature | 265 – 340°C |
|---|---|
| Nozzle Diameter | 0,4 / 0,4 mm |
| Model Materials | PC, PC-CF, PC-ABS, PC-ESD |
| Support Materials | Dedicated breakaway (ABS) |
| Print Temperature | 190 – 265°C |
|---|---|
| Nozzle Diameter | 0,6 / 0,6 mm |
| Model Materials | ABS, ASA, PP, PA-CF |
| Support Materials | HIPS (breakaway) ESM-10 (soluble) |
| Print Temperature | 190 - 265°C |
|---|---|
| Nozzle Diameter | 0,4 / 0,4 mm |
| Model Materials | ABS, PLA, PP, ASA, PA, TPU |
| Support Materials | BVOH (water soluble) HIPS (breakaway) ESM-10 (soluble) |
