Modular system used in the 3DGence INDUSTRY F421 and INDUSTRY F350 is a practical and cost-effective solution. 3DGence modular system is unique in the industrial 3D printers segment. The possibility of using three different modules in one 3D printer allows you to produce repeatable models from the widest range of filaments. Each module is customised to a specific group of materials in order to optimize the printing process. Internal modules memory saves the time that would be used for calibration. All the modules are also equipped with dual hotends and inactive nozzle lifting system.
Basic printing module dedicated for 3DGence INDUSTRY F421 and INDUSTRY F350, that allows to print the commodity materials. M280 module is also capable of printing soluble support structures from ESM-10 and HIPS.
M360 is a high-temperature module that enables INDUSTRY F421 users to print the models of ULTEM™ – high performance polymer of very good mechanical properties and capable of withstanding high temperatures. M360 can print also engineering grade materials, such as PC, PC-CF, LEXAN, PC-ABS, PEKK, ULTEM™.
M500+ is one of the interchangable modules that can reach up to 500°C of extrusion temperature. Such high temperature combined with the printer’s heated chamber allows to print high performance polymers like PEEK or PEKK on INDUSTRY F421. On M500+ module can print PEEK and PEKK on the soluble ESM-10 support.
Up to 280°C
Up to 360°C
Up to 500°C
0,5 / 0,5 mm
0,4 / 0,4 mm
0,4 / 0,4 mm
ABS, ABS Carbon, Addigy® F1030 CF10, ASA, PA6 Neat, PET, PLA, PP
ezPC-CF, LEXAN™ EXL AMHI240F, PC,
PC-ABS, PC-CF, PC-ESD, PEKK Carbon, ULTEM™ 9085
PEEK, PEEK AERO, PEEK-CF, PEKK-A, Victrex AM™200
ABS, ABS Carbon, Addigy® F1030 CF10, ASA, PA6 Neat, PET, PLA, PP
ezPC-CF, LEXAN™ EXL AMHI240F, PC,
PC-ABS FR, PC-ESD
PEEK, PEEK-CF,
Victrex AM™200
ESM-10
HIPS
ESM-10
ESM-30
ESM-10
ESM-30
| Print Temperature | 340 – 500°C |
|---|---|
| Nozzle Diameter | 0,4 / 0,4 mm |
| Model Materials | PEEK, PEKK |
| Support Materials | Dedicated breakaway ESM-10 (soluble) |
| Print Temperature | 265 – 340°C |
|---|---|
| Nozzle Diameter | 0,4 / 0,4 mm |
| Model Materials | PC, PC-CF, PC-ABS, PC-ESD |
| Support Materials | Dedicated breakaway (ABS) |
| Print Temperature | 190 – 265°C |
|---|---|
| Nozzle Diameter | 0,6 / 0,6 mm |
| Model Materials | ABS, ASA, PP, PA-CF |
| Support Materials | HIPS (breakaway) ESM-10 (soluble) |
| Print Temperature | 190 - 265°C |
|---|---|
| Nozzle Diameter | 0,4 / 0,4 mm |
| Model Materials | ABS, PLA, PP, ASA, PA, TPU |
| Support Materials | BVOH (water soluble) HIPS (breakaway) ESM-10 (soluble) |
