Modular system used in the 3DGence INDUSTRY F340 is a practical and cost-effective solution. 3DGence INDUSTRY F340 with its modular system is unique in the industrial 3D printers segment. The possibility of using four different modules in one 3D printer allows you to produce repeatable models from the widest range of filaments. Each module is customised to a specific group of materials in order to optimize the printing process. Internal modules memory saves the time that would be used for calibration. All the modules are also equipped with dual hotends and inactive nozzle lifting system.
Basic printing module dedicated for 3DGence INDUSTRY F340, that allows to print most of the commodity materials. PRO module is also capable of printing soluble support structures from ESM-10 and BVOH.
HF module is one of the interchangable 3DGence INDUSTRY F340 printing modules that features higher material flow in order to reach higher printing speeds. HF module is capable of printing reinforced model materials such as PA-CF as well as ESM-10, soluble support material.
HT is a high temperature INDUSTRY F340 module that enables user to print the models of engineering grade materials, such as PC, PC-ESD or reinforced CF-PC material.
HTmax is one of INDUSTRY F340 interchangable modules that can reach up to 500C of extrusion temperature. Such high temperature combined with the printer’s heated chamber allows to print high performance polymers like PEEK or PEKK. HTmax module can print PEEK and PEKK on the soluble ESM-10 support.
Up to 265°C
Up to 265°C
Up to 340°C
Up to 500°C
0,4 / 0,4 mm
0,6 / 0,6 mm
0,4 / 0,4 mm
0,4 / 0,4 mm
ABS, Addigy® F1030 CF10, ASA, Flexfill 98A, PA6 Neat, Nylon 680, PET, PLA
ABS, Addigy® F1030 CF10, ASA, PA6-GF30, PC-CF, PP
PC, PC-ABS, PC-CF, PC-ESD
PEEK, PEEK CF, PEKK-A
BVOH (water soluble)
HIPS (breakaway)
ESM-10 (soluble)
HIPS (breakaway)
ESM-10 (soluble)
Dedicated breakaway (ABS)
ESM-10 (soluble)
| Print Temperature | 340 – 500°C |
|---|---|
| Nozzle Diameter | 0,4 / 0,4 mm |
| Model Materials | PEEK, PEKK |
| Support Materials | Dedicated breakaway ESM-10 (soluble) |
| Print Temperature | 265 – 340°C |
|---|---|
| Nozzle Diameter | 0,4 / 0,4 mm |
| Model Materials | PC, PC-CF, PC-ABS, PC-ESD |
| Support Materials | Dedicated breakaway (ABS) |
| Print Temperature | 190 – 265°C |
|---|---|
| Nozzle Diameter | 0,6 / 0,6 mm |
| Model Materials | ABS, ASA, PP, PA-CF |
| Support Materials | HIPS (breakaway) ESM-10 (soluble) |
| Print Temperature | 190 - 265°C |
|---|---|
| Nozzle Diameter | 0,4 / 0,4 mm |
| Model Materials | ABS, PLA, PP, ASA, PA, TPU |
| Support Materials | BVOH (water soluble) HIPS (breakaway) ESM-10 (soluble) |
